PCB assembly calculator | SMD / SMT and THT assembly

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PCB production

Electronics manufacturing

PCB PRODUCTION

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Possibility of realization (working days):

Material:

Material

Select PCB substrate type:

FR-4: Standard glass-epoxy laminate. The most versatile and cost-effective choice for most electronic devices.
MCPCB - Aluminum: Metal core board with excellent heat dissipation. Used mainly in LED lighting and power modules.
MCPCB - Copper: Substrate with the highest thermal conductivity. Used in extremely heat-loaded electronic circuits and high-power supplies.
Rogers: Specialized high-frequency laminates with low loss and stable dielectric constant. Standard in professional radio and microwave technology.
PTFE - Teflon: Material with exceptional insulation parameters for very high frequencies. Used in advanced RF systems, radars, and antennas.
FPC / Flex - Flexible: Polyimide-based laminates, flexible and bend-resistant. Ideal for tight enclosures, wearables, and moving connections.

Number of layers:

Number of layers

Specify the number of copper layers on the PCB (including inner and outer layers). The number of layers significantly impacts project complexity and production costs.

Dimensions (mm):

Width: Width Specify the total length of the PCB or PCB panel. The length must comply with technical requirements for optimal use of the production panel.
Height: Height Specify the total width of the PCB or PCB panel. The width must comply with technical requirements for optimal use of the production panel.

Quantity of PCBs:

Quantity of PCBs

Enter the total number of PCBs. This value determines the order size and affects production costs.

PCB thickness:

PCB thickness

Specify the PCB thickness. Standard thicknesses include:

0.8mm,
1.6mm
and 2.0mm.

The allowable thickness tolerance is +/-10%.

Soldermask color:

Soldermask color

Choose the solder mask color. The solder mask is an insulating layer that protects the PCB from oxidation, external conditions, and facilitates soldering. Popular colors include:

green,
red,
blue
and black.

Surface finish:

Surface finish

Choose the PCB surface finish type.

HASL (Hot Air Solder Leveling) is a standard and economical choice in both lead (Pb) and lead-free (Pb-Free) versions,
ENIG (Electroless Nickel Immersion Gold) offers better quality, conductivity, and resistance to external factors,
OSP (Organic Solderability Preservative) is an eco-friendly, lead-free organic coating that provides a perfectly flat surface for high-density component mounting (SMT).

Via covering type:

Via covering type

Select via covering type:

Tented - masking the vias with solder mask;
Untented - vias completely exposed;
Plugged - vias plugged with solder mask;
Epoxy Filled&Capped - vias plugged with epoxy resin and capped with metallization;
Copper paste Filled&Capped - vias plugged with copper paste and capped with metallization.

Electrical test:

Electrical test

Electrical testing enables fast detection of potential shorts on the PCB or lack of trace continuity. Specify the scope of the electrical test:

Random – randomly selected PCBs from the ordered batch will be tested;
Full – all PCBs from the ordered batch will be tested (RECOMMENDED);
Dedicated – all PCBs from the ordered batch will be tested using a dedicated fixture (a tester built specifically for the given PCB design). Due to its speed, this method allows a significant reduction in testing cost for high‑volume production (≥ 10,000 pcs).

Copper thickness:

Copper thickness

Specify the copper thickness on the conductive layers. Standard thicknesses are:

35µm (1oz),
70µm (2oz).

The thickness of the copper affects the maximum electrical load capacity of the PCB.

Gold fingers:

Gold fingers

Specify if you want to use gold fingers on the PCB. Gold fingers are plated connecting edges, used, for example, in RAM modules or expansion cards.

Castellated holes:

Castellated holes

Specify if you want to use castellated holes (plated half-holes). These holes are used in PCB module production and allow SMD/SMT mounting of ready-made PCB modules onto other boards.

Edges of castellated holes:

Edges of castellated holes

Determine how many edges of the PCB should have metalized half-holes.

Impedance control:

Impedance control

Specify if you want to implement impedance control on the PCB. Impedance control is essential for Hi-Speed and high-frequency applications, such as RF circuits.

Material:

Material

Choose the PCB stackup with the appropriate prepreg material.

Stackup is the arrangement of PCB layers, defining the order and properties of copper layers, dielectrics, and other materials. It is crucial for impedance control and signal management.
Prepreg is an insulating material made of fiberglass impregnated with epoxy resin. It is used as a dielectric in PCBs, bonding copper layers during lamination.

Panelization:

Panelization

Specify if you want to panelize the PCB. Panelization allows to optimize electronics production and reduce costs. Choose the panelization type:

V-Cut – precise V-shaped cuts
Breaktabs – using tabs to connect individual PCBs in the panel

Format:

Columns: Columns Specify the number of columns in PCB panelization. The number of columns affects the quantity of PCBs in the panel.
Rows: Rows Specify the number of rows in PCB panelization. The number of rows affects the quantity of PCBs in the panel.

Panel margins:

Panel margins

Specify if you want to use technological margins (edge rails). The margins are used to stabilize the panel during assembly and are cut off after the production process. They can be applied to 2 or 4 sides of the PCB or panel.

Panel margin (mm):

Height:

Panel size (400×400 mm max.):

Width:
Height:

ELECTRONICS MANUFACTURING

Type of project: * Boards

Boards

The delivery will include individual PCBs, including separation costs.

Panels

The delivery will include PCB panels without separation into individual boards.

Assembly: * SMT

SMT

The quotation will include surface mount technology (SMT) assembly only SMT assembly is recommended for most solutions due to production speed and much lower cost compared to THT assembly.

THT

The quotation will include through-hole technology (THT) assembly only. THT assembly is used for larger components, such as connectors, transformers, and electrolytic capacitors. It is recommended as a complement to SMD / SMT assembly, e.g., in cases where components are subjected to heavy mechanical loads (e.g., connection sockets).

SMT & THT

The quotation will include mixed assembly, i.e., both

surface mount technology (SMT) assembly
and through-hole technology (THT) assembly.

Assembly layers: * Single layer

Single layer

The assembly will be performed on one side of the PCB (usually the TOP side).

Double layer

The assembly will be performed on both sides of the PCB (TOP and BOTTOM sides).

Assembly parameters: * Pads quantity on the board (SMT): *

Pads quantity on the board (SMT)

Enter the total number of solder pads for SMT components. The number of pads affects the assembly cost and lead time.

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Pads quantity on the board (THT): *

Pads quantity on the board (THT)

Enter the total number of solder pads for THT components. THT assembly requires more manual work than SMT assembly, hence its significantly higher cost.

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Number of unique components: *

Number of unique components

Enter the number of unique components in the design. The greater the variety of electronic components, the more complex the design and the higher the start-up costs of production.

PCB parameters: *

Width (W) of board (mm): *

Width (W) of board (mm)

Enter the total length of the PCB. The length must comply with the project's technical requirements.

Length (L) of board (mm): *

Length (L) of board (mm)

Enter the total width of the PCB. The width must comply with the project's technical requirements.

Boards quantity: *

Boards quantity

Enter the total number of PCBs. This value determines the order size and affects production costs.

Width (W) of panel (mm): *

Width (W) of panel (mm)

Enter the total length of the PCB panel. The length must include technological margins (edge rails).

Lenght (L) of panel (mm): *

Lenght (L) of panel (mm)

Enter the total width of the PCB panel. The width must include technological margins (edge rails).

Quantity of panels: *

Quantity of panels

Enter the total number of PCB panels. This value determines the order size and affects production costs.

Quantity of boards in the panel: *

Quantity of boards in the panel

Specify how many individual PCBs are contained in one panel. This value affects separation costs in the case of ordering individual PCBs.

SMT stencil production: * YES

SMT stencil production

SMT stencils are required for solder paste application on the PCB. If a permanent stencil (reusable) has already been created for this project, this step can be skipped.

SMT stencil type: * Non-permanent (single use)

Non-permanent (single use)

You are choosing a non-permanent stencil (single-use). Non-permanent stencils are cheaper but must be recreated for each new order.

Permanent (reusable)

You are choosing a permanent stencil (reusable). Permanent stencils are more expensive but can be used multiple times, up to 10,000 prints, and are also owned by the customer (with the option to ship the stencils to the customer).

Type of solder alloy: * SnBi (RoHS - lead-free)

SnBi (RoHS - lead-free)

SnBi alloy (lead-free) is ideal for components sensitive to high temperatures, such as LEDs or sensors. It is cheaper, but less mechanically durable than SAC305.

SAC305 (RoHS - lead-free)

SAC305 alloy (lead-free) is characterized by high mechanical strength and is ideal for most SMT components. It is significantly more expensive than SnBi and is not suitable for applications with components sensitive to high soldering temperatures.

Protective coating: * NO

Protective coating

Specify if you want to apply a protective coating to the PCB. The lacquered coating protects the PCB from moisture, contaminants, and corrosion.

PCB cleaning: * YES

PCB cleaning

Specify if the project requires post-production PCB cleaning. Cleaning removes flux residues and soldering remnants, which is particularly recommended for THT assembly. In the case of SMD assembly, we use No-Clean flux, allowing the cleaning process to be skipped, thereby reducing costs and lead time.

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Request an electronics production offer preparation

I represent a company NIP/VAT ID: Full Name / Company Name:

Email:

Additional Information: Attach Gerber/NC files, BOM, and Pick&Place (ZIP format) [≤ 6MB]:

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Project valuation

Approximate project valuation (currency: ):
Type of costs:	Service:	Net price (USD):	INFORMATIONS:
One-off costs:	Programming of assembly line:
	SMT stencil:

Fixed costs:
	PCB production:
	Assembly line setup:
	Assembly:

Sum:			Accuracy Guarantee You receive a real technical valuation based on the data provided. The final and binding commercial offer will be prepared after our team verifies the project parameters.

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